Electronic device and method for manufacturing the same

A method for manufacturing an electronic device, the electronic device including

• an electronic component,
• an encapsulating resin body that encapsulates the electronic component,
• a lead frame that includes an inner lead disposed inside the encapsulating resin body, and an outer lead connecting to the inner lead and protruding to an outside of the encapsulating resin body, the lead frame being extended over an inside and outside of the encapsulating resin body, and
• a bonding wire that electrically connects the electronic component and the inner lead inside the encapsulating resin body,
• the inner lead including a base member formed using a metal material, and a film disposed at least on a surface of the base member, the surface being adjacent to a bonding surface to which the bonding wire is connected,
• the film including a metal thin film that is disposed on the surface of the base member and has a connection region, at a part, to which the bonding wire is connected, and an oxide film that is made of an oxide of the same metal as a metal being a main component metal of the metal thin film, and is disposed in at least a part of a portion on the metal thin film, excluding the connection region to which the bonding wire is connected, and
• the oxide film including an uneven oxide film having a surface with continuous asperities,
• the method for manufacturing the electronic device, comprising:
• preparing the base member on which the metal thin film is disposed;
• forming the uneven oxide film by irradiating at least a part of a front end region with pulsed laser light, the front end region being a region of the bonding surface that is closer to a front end than the connection region, the front end being opposite to an end of the bonding surface adjacent to the outer lead;
• connecting the electronic component and the inner lead via the bonding wire after the forming of the uneven oxide film;
• and
• molding the encapsulating resin body so as to cover the bonding wire, the electronic component, and the inner lead.