Fan-out semiconductor package

A fan-out semiconductor package comprising:

• a first interconnection member having a through-hole;
• a semiconductor chip disposed in the through-hole, the semiconductor chip having an active surface having a connection pad disposed on the active surface, and an inactive surface opposing the active surface, a protrusion bump being disposed on the connection pad;
• an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip;
• a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip, the second interconnection member comprising an insulating layer, a redistribution layer, and a via connecting the redistribution layer to the protrusion bump,
• wherein a surface of the protrusion bump contacting the via is a planar surface.