Bottom emission microled display and a repair method thereof

A repair method of a bottom emission micro light-emitting diode (microLED) display, comprising:

• providing a transparent substrate with an original area and a repair area;
• forming a first conductive layer to result in a selection electrode and an extended electrode extended from the selection electrode towards the repair area;
• disposing a vertical-type original microLED above the selection electrode, which bonds and electrically connects with a first electrode of the microLED;
• forming entirely a first light guiding layer above the transparent substrate, the selection electrode, the extended electrode and the original microLED;
• etching the first light guiding layer to expose a second electrode of the original microLED and the transparent substrate in the repair area;
• forming a second conductive layer to result in a common electrode above the first light guiding layer in the original area, thereby electrically connecting with the second electrode of the original microLED, and to result in the second conductive layer above the exposed transparent substrate in the repair area, wherein the extended electrode and the second conductive layer in the repair area partially overlap;
• when the original microLED passes a functional test, performing the following steps:
• forming entirely a second light guiding layer above the common electrode and the first light guiding layer;
• etching the second light guiding layer to expose the common electrode and forming a top electrode above the second light guiding layer to electrically connect with the common electrode;
• when the original microLED fails the function test, performing the following steps:
• disposing a vertical-type repair microLED on the second conductive layer above the exposed transparent substrate in the repair area, such that a first electrode of the repair microLED bonds and electrically connects with the second conductive layer above the exposed transparent substrate;
• welding to electrically connect the partially overlapped second conductive layer and the extended electrode;
• forming entirely the second light guiding layer above the repair microLED, the common electrode in the original area and the first light guiding layer;
• and
• etching the second light guiding layer to expose the common electrode and a second electrode of the repair microLED, and forming the top electrode above the second light guiding layer to electrically connect the common electrode and the second electrode of the repair microLED.

A bottom emission micro light-emitting diode (microLED) display, comprising:

• a transparent substrate with an original area and a repair area;
• a selection electrode formed above the transparent substrate in the original area, an extended electrode being extended from the selection electrode towards the repair area;
• a vertical-type original microLED disposed above the selection electrode, which bonds and electrically connects with a first electrode of the original microLED;
• a first light guiding layer formed above the transparent substrate, the selection electrode, the extended electrode and the original microLED, the first light guiding layer not covering an exposed transparent substrate in the repair area;
• a common electrode formed above the first light guiding layer in the original area, and electrically connected with a second electrode of the original microLED;
• a second conductive layer formed above the exposed transparent substrate in the repair area, wherein the extended electrode and the second conductive layer in the repair area partially overlap and are welded and electrically connected;
• a vertical-type repair microLED disposed on the second conductive layer above the exposed transparent substrate in the repair area, such that the first electrode of the repair microLED bonds and electrically connects with the second conductive layer above the exposed transparent substrate;
• a second light guiding layer formed above the repair microLED in the repair area, the common electrode and the first light guiding layer in the original area;
• and
• a top electrode formed above the second light guiding layer to electrically connect the common electrode and the second electrode of the repair microLED.

A repair method of a bottom emission micro light-emitting diode (microLED) display, comprising:

• providing a transparent substrate;
• forming a selection electrode above the transparent substrate;
• forming a first insulating layer above the transparent substrate and the selection electrode;
• forming a through hole in the first insulating layer;
• forming a conductive layer and a common electrode above the first insulating layer, the conductive layer filling the through hole and thus electrically connecting with the selection electrode;
• disposing a flip-chip type original microLED above the conductive layer and the common electrode such that a first electrode of the original microLED bonds and electrically connects with the conductive layer, and a second electrode of the original microLED bonds and electrically connects with the common electrode;
• when the original microLED fails a functional test, disposing a repair microLED above the conductive layer and the common electrode, such that a first electrode of the repair microLED bonds and electrically connects with the conductive layer and a second electrode of the repair microLED bonds and electrically connects with the common electrode;
• repeating the functional test and disposing a repair microLED until passing the functional test;
• forming a light guiding layer above the first insulating layer, the conductive layer, the common electrode, the original microLED and the repair microLED;
• and
• forming a reflecting layer above the light guiding layer.

A bottom emission micro light-emitting diode (microLED) display, comprising:

• a transparent substrate;
• a selection electrode formed above the transparent substrate;
• a first insulating layer formed above the transparent substrate and the selection electrode, a through hole being formed in the first insulating layer;
• a conductive layer and a common electrode formed above the first insulating layer, the conductive layer filling the through hole to electrically connect with the selection electrode;
• a flip-chip type original microLED disposed above the conductive layer and the common electrode layer, such that a first electrode of the original microLED bonds and electrically connects with the conductive layer and a second electrode of the original microLED bonds and electrically connects with the common electrode;
• at least one repair microLED disposed above the conductive layer and the common electrode, such that a first electrode of the repair microLED bonds and electrically connects with the conductive layer and a second electrode of the repair microLED bonds and electrically connects with the common electrode;
• a light guiding layer disposed above the first insulating layer, the conductive layer, the common electrode, the original microLED and the repair microLED;
• and
• a reflecting layer disposed above the light guiding layer.