Bonding apparatus and bonding method

A bonding method of bonding substrates with each other, comprising:

• a first holding process of attracting and holding a first substrate from above by using a first holding unit configured to attract and hold the first substrate from above;
• a second holding process of attracting and holding a second substrate from below by using a second holding unit which is provided at a non-facing position where the second holding unit does not face the first holding unit and configured to attract and hold the second substrate from below;
• a temperature controlling process of controlling a temperature of the second substrate locally by using a temperature control unit which is disposed to face the second holding unit placed at the non-facing position and configured to locally adjust the temperature of the second substrate attracted to and held by the second holding unit;
• a moving process of moving, after the temperature controlling process, the second holding unit to a facing position where the second holding unit faces the first holding unit by using a moving unit configured to move the second holding unit between the non-facing position and the facing position;
• and
• a contacting process of pressing, after the moving process, a central portion of the first substrate from above and bringing the first substrate into contact with the second substrate by using a striker configured to bring the first substrate into contact with the second substrate by pressing the central portion of the first substrate from above.