Sensor Device With Media Channel Between Substrates

A sensor device, comprising:

• a first substrate having a bottom surface and a top surface;
• a second substrate having a bottom surface and a top surface, wherein the bottom surface of the second substrate is disposed over the top surface of the first substrate, wherein the first and second substrates have different materials and at least one of the first and second substrates includes a printed circuit board (PCB);
• a media channel having two vertical sections and a horizontal section, wherein the two vertical sections are through the second substrate, the horizontal section is between the first and second substrates;
• a sensor chip disposed over the top surface of the second substrate and directly above one of the two vertical sections of the media channel;
• and
• a molding compound covering at least side surfaces of the first substrate, the second substrate, and the sensor chip.

A sensor device, comprising:

• a first substrate having a bottom surface and a substantially flat top surface;
• a second substrate having a bottom surface and a top surface, wherein the bottom surface of the second substrate has a horizontal channel and is disposed over the top surface of the first substrate, the second substrate includes two vertical channels that connect the horizontal channel to the top surface of the second substrate, wherein the first and second substrates have different materials and at least one of the first and second substrates includes a printed circuit board (PCB);
• a sensor chip disposed over the top surface of the second substrate and directly above one of the two vertical channels;
• and
• a molding compound covering at least side surfaces of the first substrate, the second substrate, and the sensor chip.