Method and device for aligning a first substrate with a second substrate
AssigneeSuss Microtec Lithography GmbH
InventorKatrin Schindler
Life of this patent
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Abstract
A method for aligning a first substrate, in particular a mask, with a second substrate, in particular a wafer, comprises inserting the first substrate and the second substrate into a positioning means; capturing at least one joint image of the first substrate and the second substrate; displaying the image; a plurality of image points in the image being marked by a user; and determining a control command for actuating the positioning means on the basis of the marked image points in such a way that the substrates are aligned with one another.
Claims16
A method for aligning a first substrate, in particular a mask, with a second substrate, in particular a wafer, comprising:
- inserting the first substrate and the second substrate into a positioning means;
- capturing at least one joint image of the first substrate and the second substrate;
- displaying the image;
- a plurality of image points in the image being marked by a user;
- and
- determining a control command for actuating the positioning means on the basis of the marked image points, in such a way that the substrates are aligned with one another.
A device for aligning a first substrate with a second substrate, comprising
- a positioning means into which the substrates can be inserted;
- an image capture means which is configured to capture at least one joint image of the substrates inserted into the positioning means;
- an input device by means of which a plurality of image points can be marked in the image;
- and
- a control element which is configured to determine a control command for actuating the positioning means on the basis of the marked image points.
Dependencies are inferred from the claim text.