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US 2018/0323060 A1Published application
Substrate processing method, substrate processing apparatus, substrate processing system and recording medium
AssigneeTokyo Electron Limited
InventorYuji Katagiri
Life of this patent
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Abstract
A substrate after being subjected to a dry etching processing is prepared. Then, an ultraviolet ray having a preset peak wavelength among multiple peak wavelengths is irradiated to the substrate based on a gas used in the dry etching processing.
Claims20
A substrate processing method, comprising:
- preparing a substrate after being subjected to a dry etching processing;
- and
- irradiating an ultraviolet ray having a preset peak wavelength to the substrate based on a gas used in the dry etching processing.
A substrate processing apparatus, comprising:
- a UV irradiation unit configured to irradiate an ultraviolet ray having a preset peak wavelength to a substrate after being subjected to a dry etching processing based on a gas used in the dry etching processing.
Dependencies are inferred from the claim text.