Plasma processing devices having multi-port valve assemblies

A plasma chamber comprising:

• a top wall;
• a plurality of side walls coupled to the top wall;
• a bottom wall coupled to the plurality of side walls, wherein the bottom wall has a feed through port;
• a wafer stage that is located between the plurality of side walls, above the bottom wall, and below the top wall;
• a portion of a center column passing through the feed through port to be coupled to the wafer stage, wherein the feed through port is configured to allow passage of the center column for supporting the wafer stage;
• and
• a multi-valve port assembly that is coupled to the bottom wall to form a part of the bottom wall, the multi-valve port assembly including:
• a top plate, a plurality of openings, and a plurality of plate portions, wherein the plurality of openings of the top plate and the plurality of plate portions surround a portion of the center column, wherein the plurality of plate portions and the plurality of openings of the top plate are interleaved with respect to each other, wherein the plurality of plate portions and the plurality of openings of the top plate surround the feed through port;
• and
• a bottom plate located below the top plate and having a plurality of openings that surround the feed through port, wherein the top plate is configured to rotate in a transverse direction with respect to the bottom plate and to move in a vertical direction with respect to the bottom plate, wherein the rotation of the top plate in the transverse direction changes an amount of overlap between one of the plurality of plate portions and one of the plurality of openings of the top plate and an amount of overlap between another one of the plurality of plate portions and another one of the plurality of openings of the top plate, wherein the change in the amounts of overlap and the movement in the vertical direction modifies an amount of conductance from the plasma chamber via the plurality of openings of the top plate and the plurality of openings of the bottom plate to outside the plasma chamber.