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AssigneeGeneral Electric Company
InventorsJoo Han Kim, Nicholas Ernest Williams, Ning Liu, Predrag Hadzibabic, Lawrence Joseph Hannaford
Estimating the term…
Methods and apparatuses for cooling an electronic device assembly having a heat producing are described. An electronic device assembly includes a heat dissipation member and a dielectric two-phase heat transfer device. The dielectric heat transfer device has an evaporator region thermally attached to a hot region of the heat producing component and a condenser region thermally attached to the heat dissipation member. The dielectric two-phase heat transfer device is fabricated from a dielectric material.
An electronic device assembly comprising:
A dielectric heat transfer bobbin for supporting concentric windings, said dielectric heat transfer bobbin comprising:
A method of cooling an electronic device assembly including a heat producing component having a hot region, said method comprising:
Dependencies are inferred from the claim text.