Module for a video wall
AssigneeOSRAM Opto Semiconductors GmbH
InventorsAlexander Martin, Thomas Schwarz, Frank Singer, Andreas Plössl
Life of this patent
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AssigneeOSRAM Opto Semiconductors GmbH
InventorsAlexander Martin, Thomas Schwarz, Frank Singer, Andreas Plössl
Estimating the term…
A module for a video wall includes a first light emitting chip of an image pixel connecting to a first power line by a first electrical terminal, the first light emitting chip connects to a third power line by a second electrical terminal, a second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first and/or the second power line are/is a surface metallization, including contact sections, a light emitting chip is arranged on a contact section, at least between contact sections of a first and of a second power line an insulation layer is provided on a carrier, the insulation layer includes openings above the contact sections, and the light emitting chips are arranged in the openings.
1-15. (canceled)
A module for a video wall comprising a carrier comprising a multiplicity of image pixels, wherein an image pixel is formed by at least one first and one second light emitting chip, each light emitting chip comprises a first and a second electrical terminal, the first light emitting chip of an image pixel connects to a first power line by the first electrical terminal, the first light emitting chip of an image pixel connects to a third power line by the second electrical terminal, the second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first and/or the second power line are/is in the form of a surface metallization, the surface metallization comprises contact sections, a light emitting chip is arranged on a contact section, at least between contact sections of a first and of a second power line an insulation layer is provided on the carrier, the insulation layer comprises openings above the contact sections, and the light emitting chips are arranged in the openings.
Dependencies are inferred from the claim text.