Memory module cooling assembly
AssigneeSeagate Technology LLC
InventorsShankar Gopalakrishna, Vivekananda Avvaru, Saju Cheeran Verhgese Francis
Life of this patent
Estimating the term…
Abstract
An electronic memory module can be cooled by a cooling assembly that consists of at least a printed circuit board connected to at least one data storage component. The memory module may be housed within, and in physical contact with, a cooling frame that surrounds a periphery of the printed circuit board. The cooling frame can have a seating tab that is separated from the memory module, spans the memory module, and supports a heatsink in contact with the at least one data storage component.
Claims20
An apparatus comprising a memory module having a printed circuit board physically attached to at least one data storage component, the memory module housed within and contacting a cooling frame surrounding a periphery of the printed circuit board, the cooling frame having a seating tab separated from the memory module, spanning the memory module, and supporting a heatsink in contact with the at least one data storage component.
A system comprising a memory module having a printed circuit board physically attached to first and second data storage components, the memory module housed within and contacting a cooling frame surrounding a periphery of the printed circuit board, the cooling frame having a seating tab separated from the memory module, spanning the memory module, and supporting a first heatsink in contact with the first data storage component on a first side of the memory module, the cooling frame comprising a flexible tab extending to secure a second heatsink in contact with the second data storage component on a second side of the memory module.
A method comprising:
- positioning a first heatsink in a cooling frame, the first heatsink supported by a seating tab of the cooling frame, the seating tab spanning the cooling frame;
- tilting a memory module at a non-normal angle with respect to the cooling frame, the memory module physically attached to at least one data storage component;
- inserting the memory module into the cooling frame;
- and
- rotating the memory module towards the first heatsink to contact the first heatsink, the cooling frame limiting movement of the first heatsink and memory module along perpendicular axes.
Dependencies are inferred from the claim text.