Component communications in system-in-package systems
AssigneeOctavo Systems LLC
InventorsKevin Michael Troy, Peter Robert Linder, Masood Murtuza, Gene Alan Frantz
Life of this patent
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Abstract
A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.
Claims37
A System-in-Package (SiP) device, comprising:
- a substrate;
- a power management device;
- a microprocessor;
- one or more additional components, wherein said additional components and said microprocessor are arranged such that the SiP device performs one or more preselected functions;
- and
- a package encapsulating said power management device, said microprocessor, and said additional components, with a plurality of external connectors,
- wherein said external connectors are at least partially exposed from said package,
- wherein a first plurality of said external connectors are for providing and/or receiving signals corresponding to said one more preselected functions during normal operation of the SiP device, and
- wherein a second plurality of said external connectors are for providing and/or receiving communications signaling for one or more of said power management device and said microprocessor.
A Power Management Integrated Circuit (PMIC), comprising:
- at least one programmable power generating subsystem configured to output a plurality of signals, wherein a first of said plurality of signals has a first value for powering one or more components of a device, and a second of said plurality of signals has a second value, wherein said first value is an operational value and said second value is a monitoring value indicative of said first value;
- and
- a control logic subsystem for setting said first value.
A System-in-Package (SiP) device, comprising:
- a PMIC using selected communication signals to control outputs from power generating subsystems of said PMIC to control whether said power generating subsystems of said PMIC provide power to components of said SiP or establish desired output voltages for each of said power generating subsystems.
A method for configuring power management of a device, comprising:
- mounting a Power Management Integrated Circuit (PMIC) and a microprocessor on a substrate having operative interconnections between said PMIC and microprocessor;
- packaging said substrate to form a System-in-Package (SiP) device such that said PMIC and said microprocessor are fully encapsulated in said SiP device;
- and
- after said packaging, configuring said PMIC.
A method for powering a System-in-Package (SiP) device, comprising:
- mounting the SiP device on a substrate;
- communicating with a power management device encapsulated in the SiP device through one or more external connectors of the SiP device to stop power delivery from said power management device to at least one component of the SiP device;
- powering of said at least one component of the SiP device by the substrate through the one or more external connectors.
Dependencies are inferred from the claim text.