Metrology Guided Inspection Sample Shaping of Optical Inspection Results
AssigneeKLA-Tencor Corporation
InventorsKaushik Sah, Andrew James Cross, Antonio Mani
Life of this patent
Estimating the term…
Abstract
Information from metrology tools can be used during inspection or review with a scanning electron microscope. Metrology measurements of a wafer are interpolated and/or extrapolated over a field, which creates modified metrology data. The modified metrology data is associated with defect attributes from inspection measurements of a wafer. A wafer review sampling plan is generated based on the defect attributes and the modified metrology data. The wafer review sampling plan can be used during review of a wafer using the scanning electron microscope.
Claims18
A method comprising:
- receiving metrology measurements and inspection measurements at a controller, wherein the metrology measurements and inspection measurements are of one or more wafers;
- interpolating and/or extrapolating, using the controller, the metrology measurements over a field of a wafer thereby creating modified metrology data;
- associating, using the controller, defect attributes from the inspection measurements with the modified metrology data;
- and
- generating, using the controller, a wafer review sampling plan based on the defect attributes and the modified metrology data.
A system comprising:
- a controller in electronic communication with a scanning electron microscope and a metrology tool, wherein the controller includes a processor and an electronic data storage unit in electronic communication with the processor, and wherein the controller is configured to:
- receive metrology measurements and inspection measurements of one or more wafers;
- interpolate and/or extrapolate the metrology measurements over a field of a wafer thereby creating modified metrology data;
- associate defect attributes from the inspection measurements with the modified metrology data;
- and
- generate a wafer review sampling plan based on the defect attributes and the modified metrology data.
A non-transitory computer readable medium storing a program configured to instruct a processor to:
- interpolate and/or extrapolate metrology measurements of one or more wafers over a field of a wafer thereby creating modified metrology data;
- associate defect attributes from inspection measurements of the wafer with the modified metrology data;
- and
- generate a wafer review sampling plan based on the defect attributes and the modified metrology data.
Dependencies are inferred from the claim text.