Light module having a heatsink crimped around a printed circuit board, and a method for crimping a heat sink around a printed circuit board

A method for manufacturing a light module, comprising:

• positioning at least one of two first edges of a printed circuit board in at least one channel defined in at least one of two second edges of a heatsink, the at least one of the second edges of the heatsink having an arm extending over the at least one of the first edges of the printed circuit board, the printed circuit board having at least one light emitting diode, the printed circuit board being substantially planar and having a length and a width, the two first edges of the printed circuit board extending substantially the length of the printed circuit board, the heatsink extending substantially the width and the length of the printed circuit board, the heatsink including the two second edges along the length of the printed circuit board;
• and
• crimping the arm of the at least one of the second edges of the heatsink to capture the at least one of the first edges of the printed circuit board in the at least one channel, wherein the arm extends over the at least one of the first edges of the printed circuit board prior to and after crimping.