Vertical stack memory device
AssigneeSamsung Electronics Co., Ltd.
InventorsKYUNG-HWAN LEE, MIN-KYUNG BAE, BYOUNG-TAEK KIM, HYE-JIN CHO, YONG-SEOK KIM, TAE-HUN KIM, JUN-HEE LIM
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AssigneeSamsung Electronics Co., Ltd.
InventorsKYUNG-HWAN LEE, MIN-KYUNG BAE, BYOUNG-TAEK KIM, HYE-JIN CHO, YONG-SEOK KIM, TAE-HUN KIM, JUN-HEE LIM
Estimating the term…
A vertical stack memory device includes a doped semiconductor substrate having a common source to which a source power is applied and a low band gap layer that is spaced apart from the common source, and the low band gap comprising low band gap materials. A stack gate structure has gate electrodes and insulation interlayer patterns that are alternately and vertically stacked on the substrate in a first direction. A channel structure penetrates through the stack gate structure in the first direction. The channel structure makes contact with the low hand gap layer. A charge storage structure is interposed between the stack gate structure and the channel structure. The charge storage structure is configured to selectively store charge and to provide the stored charge to a memory cell, the stack gate structure, and the channel structure.
A vertical stack memory device comprising:
A vertical stack memory device comprising:
A stacked memory device, comprising:
The stacked memory device of clam 16, wherein the low hand gap layer is spaced apart from the common source.
The stacked memory device of clam 16, wherein the stack gate structure includes a plurality of gate electrodes and a plurality of insulation interlayer patterns that are alternately and vertically stacked on the substrate.
The stacked memory device of dam 16, wherein the channel structure penetrates through the stack gate structure to make contact with the low band gap layer.
The stacked memory device of clam 16, wherein the charge storage structure is interposed between the stack gate structure and the channel structure.
Dependencies are inferred from the claim text.