Vertically curved mechanically flexible interconnects, methods of making the same, and methods of use

A substrate, comprising:

• a first mechanically flexible interconnect having a first thickness;
• a second mechanically flexible interconnect having a second thickness;
• and
• wherein the first thickness and the second thickness are different, wherein the first mechanically flexible interconnect and the second mechanically flexible interconnect have a substantially equivalent compliance.

A bridge chip for connecting a plurality of chips, the bridge chip being configured to:

• connect a first side of the bridge chip to a first chip via a first plurality of bumps;
• connect the first side of the bridge chip to a second chip via a second plurality of bumps;
• connect a second side of the bridge chip to a substrate;
• and
• wherein the first chip is connected to the substrate via a first mechanically flexible interconnect, the second chip is connected to the substrate via a second mechanically flexible interconnect, and wherein the first mechanically flexible interconnect and the second mechanically flexible interconnect have a similar compliance.

A method, comprising:

• moving a testing interface into a testing position, wherein the testing interface comprises a first mechanically flexible interconnect and a second mechanically flexible interconnect, each of the first mechanically flexible interconnect and the second mechanically flexible interconnect having a similar compliance;
• contacting the first mechanically flexible interconnect with a first portion of a circuit;
• contacting the second mechanically flexible interconnect with a second portion of the circuit;
• and
• testing the first portion of the circuit and the second portion of the circuit.