Thermal conductive resin composition, thermal conductive sheet, and semiconductor device

A thermal conductive resin composition comprising;

• an epoxy resin;
• a cyanate resin;
• and
• a thermal conductive filler,
• wherein a content of the thermal conductive filler is equal to or more than 60% by mass and equal to or less than 85% by mass with respect to 100% by mass of the total solid content of the thermal conductive resin composition, and
• wherein a thermal conductivity at 25° C., which is measured by the following thermal conductivity test, is equal to or more than 3 W/(m·k), and cracking does not occur when the following flex resistance test is carried out.
• <Thermal Conductivity Test>
• The thermal conductive resin composition is thermally treated at 100° C. for 30 minutes, thereby producing a B-stage-form thermal conductive sheet having a film thickness of 400 then, the thermal conductive sheet is thermally treated at 180° C. and 10 MPa for 40 minutes, thereby obtaining a thermal conductive sheet cured substance, and then the thermal conductivity of the thermal conductive sheet cured substance in a thickness direction is measured using a laser flash method.
• <Flex Resistance Test>
• The thermal conductive resin composition is thermally treated at 100° C. for 30 minutes, thereby producing a B-stage-form thermal conductive sheet having a film thickness of 400 and then a 100 mm×10 mm piece is cut out from the thermal conductive sheet and is folded along a curved surface of a cylinder having a diameter of 10 mm at a bending angle of 180 degrees in an environment of 25° C. at a central portion in a longitudinal direction.