Cooling arrangement for a power supply module
AssigneeTDK-Lambda Corporation
InventorsMiki Stravets, George Rucareanu
Life of this patent
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AssigneeTDK-Lambda Corporation
InventorsMiki Stravets, George Rucareanu
Estimating the term…
A power supply module for facilitating an increased flow of cooling air comprises a chassis in which circuitry of the power supply module is housed, and a front panel associated with the chassis. The power supply module is configured with one or more airflow openings which facilitate a flow of cooling air into or out of a chassis interior and which are ensured of remaining unblocked, wherein one of the chassis and the front panel is formed with one or more inclined surfaces to define at least a part of a corresponding passageway through which air crossing a portion of the front panel is flowable. The one or more inclined surfaces is apertured to define the one or more airflow openings or an aperture in fluid communication with the one or more airflow openings.
A power supply module for facilitating an increased flow of cooling air, comprising a chassis in which circuitry of the power supply module is housed, and a front panel associated with said chassis,
Dependencies are inferred from the claim text.