Thermally Efficient Compute Resource Apparatuses and Methods
AssigneeIntel Corporation
InventorsMATTHEW J. ADILETTA, AARON GORIUS, MYLES WILDE, MICHAEL T. CROCKER
Life of this patent
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Abstract
Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds can house physical resources and heat sinks thermally coupled to the physical resources. The physical resources are arranged on the sleds and the heat sinks are configured so as to limit thermal shadowing between physical resources to reduce interference with airflow provided by fans of the racks.
Claims25
A data center sled, comprising:
- a substrate having a top surface and a bottom surface;
- a first plurality of physical resources disposed on the top surface of the substrate;
- and
- at least one heat sink coupled to the top surface of the substrate and thermally coupled to the first plurality of physical resources, the first plurality of physical resources arranged on the top surface laterally across the top surface of the substrate to reduce thermal shadowing between ones of the first plurality of physical resources.
A heat sink for a plurality of physical resources of a sled of a data center, the heat sink comprising:
- a thermal contact plate for each one of a plurality of physical resources, each of the thermal contact plates to thermally coupled to the one of the plurality of physical resources;
- at least one post for each one of the plurality of thermal contact plates, the at least one post mechanically and thermally coupled to the one of the plurality of thermal contact plates;
- and
- a plurality of plates, each of the plurality of plates disposed in a parallel planes and fixed in a stack via the at least one posts of each of the plurality of thermal contact plates.
A system for a data center comprising:
- a rack comprising at least one fan to provide an airflow;
- a sled to couple to the rack in a position to receive the airflow, the sled comprising:
- a substrate having a top surface and a bottom surface;
- a first plurality of physical resources disposed on the top surface of the substrate;
- and
- at least one heat sink coupled to the top surface of the substrate and thermally coupled to the first plurality of physical resources, the first plurality of physical resources arranged on the top surface laterally across the top surface of the substrate to reduce thermal shadowing of the airflow between ones of the first plurality of physical resources, the sled disposed in the rack.
Dependencies are inferred from the claim text.