Circuit carrier and a method for producing a circuit carrier
AssigneeRobert Bosch GmbH
InventorsHarun Bueyuekgoez, Roland Gerstner, Josef Weber
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Abstract
The invention relates to a circuit carrier (1) comprising a plurality of inorganic substrate layers (1.1) that have partial metallisations (1.2, 1.3, 1.4, 1.5, 1.6) for the purpose of electrical and/or thermal conduction, and to a corresponding method for producing such a circuit carrier (1). According to the invention, at least one partial metallisation is made in the form of an insert (1.2) that fills a corresponding shaped hole (1.7) introduced into one of said inorganic substrate layers (1.1).
Claims11
A circuit carrier (1, 1A) having a plurality of inorganic substrate layers (1.1) that have partial metallizations (1.2, 1.3, 1.4, 1.5, 1.6) for electrical and/or thermal conduction, characterized in that at least one of the partial metallizations is configured as an inserted part (1.2) which fills a corresponding shaped hole (1.7) that is introduced into one of the inorganic substrate layers (1.1).
Dependencies are inferred from the claim text.