US 2018/0027665 A1 · IMPLEMENTING BACKDRILLING ELIMINATION UTILIZING ANTI-ELECTROPLATE COATING

Abstract

A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.

Claims19

Dependent claims

A method for implementing enhanced via creation without creating a via barrel stub during printed circuit board (PCB) manufacturing comprising:

providing a printed circuit board (PCB);
said printed circuit board (PCB) having an internal conductive trace;
forming a via extending through the printed circuit board (PCB) including the internal conductive trace;
and
inserting a plug into the via extending from a first surface to below the internal conductive trace;
applying an anti-electroplate coating covering the walls of the via below the signal trace;
said anti-electroplate coating eliminating via barrel stub creation during the PCB manufacturing;
and
removing the plug and performing PCB plating.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/217,019Filed 22 Jul 2016

Published

25 Jan 2018

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

H05K 3/425
Plated through-holes or plated via connections: characterised by the sequence of steps for plating the through-holes or via connections in…
H05K 3/429
Plated through-holes or plated via connections: plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit…
H05K 1/034
Consisting of one material: containing halogen
H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections

Implementing backdrilling elimination utilizing anti-electroplate coating

Life of this patent

Implementing backdrilling elimination utilizing anti-electroplate coating

Life of this patent

Abstract

Claims19