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US 2018/0027664 A1Published application
Solder resist and printed wiring board
AssigneeIbiden Co., Ltd.
InventorYuji IKAWA
Life of this patent
Estimating the term…
Abstract
A solder resist includes a lower layer including a first resin and particles, and an upper layer including a second resin and formed on the lower layer. The particles are one kind selected from a group of inorganic particles, and the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles.
Claims20
A solder resist, comprising:
- a lower layer comprising a first resin and a plurality of particles;
- and
- an upper layer comprising a second resin and formed on the lower layer,
- wherein the plurality of particles is one kind selected from a group of inorganic particles, and the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles.
1 more element
A printed wiring board, comprising:
- an outermost resin insulation layer;
- an outermost conductive layer formed on the outermost resin insulation layer;
- and
- a solder-resist layer formed on the outermost resin insulation layer and having a plurality of opening portions formed such that the opening portions are exposed portions of the outermost conductive layer,
- wherein the solder-resist layer comprises a lower layer comprising a first resin and a plurality of particles, and an upper layer comprising a second resin and formed on the lower layer. the plurality of particles is one kind selected from a group of inorganic particles, and the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles.
2 more elements
Dependencies are inferred from the claim text.