Board and electronic device
AssigneeFujitsu Limited
InventorsTakashi KANDA, Shunji Baba
Life of this patent
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Abstract
A board includes a substrate having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other. And an electronic device includes a board having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other.
Claims6
A board comprising:
- a substrate having a bending property;
- a wiring pattern formed over the substrate and having a bending property;
- a conductive member formed over the wiring pattern;
- an electronic component;
- and
- a bonding member that bonds the conductive member and the electronic component to each other.
An electronic device comprising:
- a board having a bending property;
- a wiring pattern formed over the substrate and having a bending property;
- a conductive member formed over the wiring pattern;
- an electronic component;
- and
- a bonding member that bonds the conductive member and the electronic component to each other.
Dependencies are inferred from the claim text.