Circuit board and manufacturing method thereof
AssigneeUnimicron Technology Corp.
InventorsChun-Ting Lin, Tsung-Si Wang
Life of this patent
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Abstract
A circuit board including a substrate, a patterned circuit layer and a photo-imaginable dielectric layer is provided. The substrate has a first surface and a second surface opposite to each other. The patterned circuit layer is disposed on the first surface, and a line width of the patterned circuit layer gradually reduces from the first surface towards the second surface. The photo-imaginable dielectric layer is disposed in the substrate corresponding to the patterned circuit layer. In addition, a manufacturing method of the circuit board is also proposed.
Claims12
A circuit board, comprising:
- a substrate, having a first surface and a second surface opposite to each other;
- a patterned circuit layer, disposed on the first surface, and a line width of the patterned circuit layer gradually reducing from the first surface towards the second surface;
- and
- a patterned photo-imaginable dielectric layer, disposed in the substrate corresponding to the patterned circuit layer.
A manufacturing method of a circuit board, comprising:
- providing a first carrier, the first carrier having a third surface and a fourth surface opposite to each other, wherein a release film and a first metal layer are respectively disposed on the third surface and the fourth surface in sequence;
- forming a photo-imaginable dielectric layer on the first metal layer, and patterning the photo-imaginable dielectric layer;
- forming a patterned dry film layer on the photo-imaginable dielectric layer, and the patterned dry film layer exposing a part of the first metal layer and the photo-imaginable dielectric layer;
- electroplating a second metal layer on the part of the first metal layer by using the patterned dry film layer as an electroplating mask, and forming a first surface finish layer on the second metal layer;
- removing the patterned dry film layer to expose another part of the photo-imaginable dielectric layer and the first metal layer;
- etching the first metal layer by using the photo-imaginable dielectric layer as an etching mask to form a patterned circuit layer on the release film;
- coating a solder resist material on the patterned circuit layer and the photo-imaginable dielectric layer to form a substrate, and exposing the first surface finish layer, wherein the substrate has a first surface and a second surface opposite to each other, the first surface contacts the release film, and a line width of the patterned circuit layer gradually reduces from the first surface towards the second surface;
- disposing a second carrier on the second surface, and removing the first carrier from the first surface through the release film;
- and
- forming a second surface finish layer on the patterned circuit layer exposed on the first surface.
Dependencies are inferred from the claim text.