US 2018/0027649 A1 · CONDUCTING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Abstract

A strip for an electronic device senses a liquid sample. The strip includes a substrate having a first surface, a plurality of protrusions disposed on the first surface, and each having a width, and a hydrophilic layer having a layer surface disposed on the first surface and the plurality of protrusions, and having a second surface opposite to the layer surface, whereby the liquid sample and the second surface have a contact angle therebetween ranging from 2 to 85 degrees when the liquid sample is disposed on the hydrophilic layer.

Claims25

Dependent claims

A strip for an electronic device configured to sense a liquid sample, comprising:

a substrate having a first surface;
a plurality of protrusions disposed on the first surface, and each having a width;
and
a hydrophilic layer having a layer surface disposed on the first surface and the plurality of protrusions, and having a second surface opposite to the layer surface, whereby the liquid sample and the second surface have a contact angle therebetween ranging from 2 to 85 degrees when the liquid sample is disposed on the hydrophilic layer.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

15/718,507Filed 28 Sep 2017

Priority

TW 10214938931 Dec 2013

Published

25 Jan 2018

Term ends

Not estimatedThe source records don’t support an estimate.

Classification24 codes

H05K 1/0272
Details: adaptations for fluid transport, e.g. channels, holes
G01N 31/00
Investigating or analysing non-biological materials by the use of the chemical methods
G01N 33/18
Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00: water
G01N 33/48707
Of liquid biological material: by electrical means

Conducting package structure and manufacturing method thereof

Life of this patent

Conducting package structure and manufacturing method thereof

Life of this patent

Abstract

Claims25