Substrate unit
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorsHideaki Tahara, Kazuyoshi Ohara, Munsoku O, Arinobu Nakamura
Life of this patent
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AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorsHideaki Tahara, Kazuyoshi Ohara, Munsoku O, Arinobu Nakamura
Estimating the term…
Provided is a substrate unit that has an excellent heat dissipation capability. A substrate unit includes: a substrate having a conductive pattern formed on one surface thereof, the substrate being provided with an opening; a conductive member that includes a main portion that is fixed to the other surface of the substrate, and to which at least one terminal of an electronic component is electrically connected via the opening that is formed in the substrate; and a heat dissipation member with which an extension portion that extends from the main portion of the conductive member is in contact.
A substrate unit comprising:
Dependencies are inferred from the claim text.