Thin-film heating device
AssigneeE. I. Du Pont de Nemours and Company
InventorsKURT DOUGLAS ROBERTS, JONATHAN A. WELDON
Life of this patent
Estimating the term…
Abstract
A thin-film heating device includes a base layer, a bus bar layer and an electrode layer. The base layer includes a polymeric resistive layer, including conductive filler, in contact with a polymeric dielectric layer. The polymeric resistive layer has a sheet resistance in a range of from about 0.5 ohm/square to about 2 Megaohm/square. The bus bar layer is adhered to the polymeric dielectric layer of the base layer. The bus bar layer includes a first patterned conductive material. The electrode layer includes a second patterned conductive material and is electrically connected to the bus bar layer.
Claims14
A thin-film heating device comprising:
- a base layer comprising a polymeric resistive layer comprising conductive filler in contact with a polymeric dielectric layer, wherein the polymeric resistive layer has a sheet resistance in a range of from about 0.5 ohm/square to about 2 Megaohm/square;
- a bus bar layer adhered to the polymeric dielectric layer of the base layer, wherein the bus bar layer comprises a first patterned conductive material;
- and
- an electrode layer adhered to the polymeric resistive layer of the base layer, wherein the electrode layer comprises a second patterned conductive material and is electrically connected to the bus bar layer.
Dependencies are inferred from the claim text.