Camera module including multilayer base body, image sensor ic, lens unit, peripheral circuit components, and connector element and electronic device including same

A camera module comprising:

• a multilayer base body with a flat film configuration, and including a plurality of flexible base material layers;
• an image sensor IC including a light receiving element;
• a lens unit that condenses light to the light receiving element;
• peripheral circuit components that are connected to the image sensor IC and the lens unit;
• and
• a connector element configured to provide connection to outside;
• wherein
• the multilayer base body includes a first mounting portion, a second mounting portion, and a connecting portion interconnecting the first mounting portion and the second mounting portion, integrated together when looked at in a plan view;
• the multilayer base body includes a cavity in a first principal surface of the first mounting portion;
• the image sensor IC is arranged in the cavity with the light receiving element directed toward the other principal surface of the first mounting portion;
• the lens unit is arranged at a second principal surface side of the multilayer base body to be optically coupled to the light receiving element;
• at least one of the peripheral circuit components is incorporated in a portion of the plurality of flexible base material layers of the first mounting portion of the multilayer base body;
• the portion of the plurality of flexible base material layers of the first mounting portion defines a sidewall of the cavity;
• each of the plurality of flexible base material layers in the portion are made of the same material;
• the connector element is arranged in the second mounting portion;
• the at least one of the peripheral circuit components is incorporated in the multilayer base body in the first mounting portion at a position opposing to the image sensor IC in a thickness direction of the multilayer base body;
• and
• the at least one of the peripheral circuit components is incorporated in the first mounting portion at a position closer to the connecting portion than a position of the cavity.