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US 2018/0026342 A1Published application
Electronic module
AssigneeUniversal Scientific Industrial (Shanghai) Co., Ltd.
InventorsHsin-Hong CHEN, Jui-Kun SHIH, Chun-Huang LI
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Abstract
The present disclosure provides an electronic module. The electronic module comprises an IC, a substrate and an antenna. The substrate has a top surface, a bottom surface and a lateral surface. The IC is electrically connected to the bottom surface. The antenna is disposed on at least two of the top surface, the bottom surface and the lateral surface.
Claims20
An electronic module, comprising:
- an integrated circuit (IC);
- a substrate having a top surface, a bottom surface and a lateral surface, the IC electrically connected to the bottom surface;
- and
- an antenna disposed on at least two of the top surface, the bottom surface and the lateral surface.
1 more element
An electronic module, comprising:
- an integrated circuit (IC);
- a substrate having a top surface, a bottom surface and a lateral surface, the IC electrically connected to the bottom surface;
- a first antenna array disposed on the top surface;
- a second antenna array disposed on the lateral surface;
- and
- a third antenna array disposed on the bottom surface.
3 more elements
An electronic module, comprising:
- an integrated circuit (IC);
- a substrate having a top surface, a bottom surface and a lateral surface, the IC electrically connected to the bottom surface;
- an antenna disposed on at least two of the top surface, the bottom surface and the lateral surface;
- and
- a frame board disposed on the bottom surface for electrically connecting the substrate to a circuit board.
2 more elements
Dependencies are inferred from the claim text.