Assembly of electronic components
AssigneeSTMicroelectronics (Tours) SAS
InventorsMohamed Boufnichel, Julien Ladroue
Life of this patent
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Abstract
Identical planar electronic components are stacked in an assembly. Each component has two contact metallizations positioned on edges of a same surface of the component. The components are stacked along a common axis. Each successive component is rotated about the common axis by a fixed angle. A value of the fixed angle is selected to position, side by side, the contact metallization of one component and the contact metallization of another next component adjacent to each other in the stack. Electrical connections are provided between two adjacent contact metallizations.
Claims20
A device, comprising:
- a plurality of identical planar electronic components stacked on each other along an axis Z that is orthogonal to opposed top and bottom surfaces to form an assembly,
- each planar electronic component including two contact metallizations positioned on edges of a same surface of the planar electronic component,
- wherein each successive planar electronic component in said assembly is rotated around the axis Z by a fixed angle relative to an adjacent planar electronic component in said assembly, the fixed angle have a value that positions, side by side, one of the contact metallizations of one planar electronic component and one of the contact metallizations of another planar electronic component adjacent said one planar electronic component, and
- an electrical connections between two adjacent contact metallizations.
A device, comprising:
- a first planar electronic component including a first contact metallization and a second contact metallization, said first and second contact metallizations positioned on a peripheral edge of the first planar electronic component;
- a second planar electronic component including a third contact metallization and a fourth contact metallization, said third and fourth contact metallizations positioned on a peripheral edge of the second planar electronic component;
- wherein the first and second planar electronic components are stacked one on top of the other to form an assembly sharing a common axis;
- wherein an orientation of the first contact of the first planar electronic component is angularly offset about the common axis from an orientation of third contact of the second planar electronic component;
- and
- a first electrical connection between the first and third contacts.
Dependencies are inferred from the claim text.