Semiconductor device, power circuit, and computer
AssigneeKabushiki Kaisha Toshiba
InventorsTatsuo SHIMIZU, Hisashi Saito
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AssigneeKabushiki Kaisha Toshiba
InventorsTatsuo SHIMIZU, Hisashi Saito
Estimating the term…
A semiconductor device according to an embodiment includes a nitride semiconductor layer and an insulating layer including an oxide film or an oxynitride film that contacts with the nitride semiconductor layer. The oxide film or the oxynitride film includes at least one impurity selected from the group consisting of boron (B), gallium (Ga), aluminum (Al), and indium (In) and carbon (C). A first peak of a concentration distribution of the at least one impurity in the insulating layer is present in the oxide film or the oxynitride film. A second peak of a concentration distribution of carbon in the insulating layer is present in the oxide film or the oxynitride film. A distance between the first peak and the nitride semiconductor layer is equal to or less than 5 nm, and a distance between the second peak and the nitride semiconductor layer is equal to or less than 5 nm.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.