Power electronic switching device, arrangement herewith and methods for producing the switching device

A method for producing a configuration of a power electronic switching device (1), comprising the steps of:

• A. providing a substrate (2), further comprising:
• an insulation layer (20) and conductor tracks (22) electrically insulated from one another;
• wherein, on one of the conductor tracks (22), a power semiconductor component (7) is arranged and is connected to the conductor track (22) in a cohesive manner;
• B. providing a connection device (3), wherein:
• said connection device is embodied as a film stack embodied alternately with two electrically conductive, inherently structured films (30, 34) and an electrically insulating film (32) between the two conductive films (30, 34);
• C. arranging an adhesive substance (36) on one of the substrate (2) and the connection device (3) at at least one adhesive section which does not serve for an electrically conductive connection between said substrate (2) and said connection device (3);
• D. arranging and adhesively connecting the connection device (3) to the substrate (2) by means of the adhesive substance (36);
• and
• E. introducing an urging pressure on the connection device (3) by positioning a pressure device (5) and a pressure introducing device (6) so that a force-locking and electrically conductive connection is formed between the connection device (3) and the conductor track (22).

A method for producing a configuration of a power electronic switching device (1), comprising the steps of:

• a. providing a substrate (2), said substrate (2) further comprising:
• an insulation layer (20) and conductor tracks (22) electrically insulated from one another;
• b. providing a connection device (3) embodied as a film stack arranged alternately with two electrically conductive structured films (30, 34) spaced by an electrically insulating film (32) between the two conductive films (30, 34);
• c. arranging a power semiconductor component (7) on an assigned conductor track (22);
• d. arranging an adhesive substance (36) between respective said power semiconductor component (7) and said assigned conductor track (22) and adhesively fixing the power semiconductor component (7) on said conductor track (22);
• e. arranging and adhesively connecting the connection device (3) to the substrate (2) by with said adhesive substance (36);
• and
• f. introducing a pressure on the connection device (3) with a pressure device (5) and a pressure introducing device (6) and providing a force-locking electrically conductive connection between the connection device (3) and an assigned conductor track (22).