Embedded Passive Chip Device and Method of Making the Same
AssigneeWafer Mems Co., Ltd.
InventorsMin-Ho Hsiao, Pang-Yen Lee, Yen-Hao Tseng
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Abstract
An embedded passive chip device includes a chip body and a functional layered structure. The chip body has a circuit-forming surface that is formed with a recess. The functional layered structure is formed on the chip body and includes a conductive layer that has at least a portion which covers at least partially the circuit-forming surface, and a magnetic layer that is disposed within the recess and that is inductively coupled to the conductive layer for generating inductance. A method of making the embedded passive chip device is also disclosed.
Claims8
An embedded passive chip device comprising:
- a chip body having a first circuit-forming surface that is formed with a first recess;
- and
- a first functional layered structure formed on said chip body and including a first conductive layer that has at least a portion which covers at least partially said first circuit-forming surface, and a first magnetic layer that is disposed within said first recess and that is inductively coupled to said first conductive layer for generating inductance.
The embedded passive chip device of claim 3, wherein said first conductive layer is in the form of a coil, and is disposed around said chip body.
Dependencies are inferred from the claim text.