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US 2018/0026089 A1Published application
Printed circuit boards including drive circuits, and related semiconductor devices
AssigneeSamsung Electronics Co., Ltd.
InventorsMINHWA JANG, JUNGEUN KOO, YECHUNG CHUNG
Life of this patent
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Abstract
Semiconductor devices are provided. A semiconductor device includes a substrate, a controller on the substrate, first and second drive circuits on the substrate, and a plurality of signal lines on the substrate that connect the controller to the first and second drive circuits. The plurality of signal lines are each at the same vertical level and are horizontally spaced apart from each other. Related printed circuit boards are also provided.
Claims20
A semiconductor device, comprising:
- a base substrate;
- a timing controller chip on the base substrate;
- first and second drive circuit chips on the base substrate;
- and
- a plurality of signal lines on the base substrate, the plurality of signal lines being positioned at a same vertical level and horizontally spaced apart from each other,
- wherein the plurality of signal lines comprise:
- a first data signal line and a first control signal line that electrically connect the timing controller chip with the first drive circuit chip;
- and
- a second data signal line and a second control signal line that electrically connect the timing controller chip with the second drive circuit chip.
6 more elements
A printed circuit board, comprising:
- a base substrate including a first region comprising a timing controller chip, a second region comprising a first drive circuit chip, and a third region comprising a second drive circuit chip;
- a first data signal pad, a second data signal pad, a first control signal pad, and a second control signal pad that are on the first region;
- a data signal pad and a control signal pad that are on the second region;
- a data signal pad and a control signal pad that are on the third region;
- a first data signal line that connects the first data signal pad of the first region to the data signal pad of the second region;
- a first control signal line that connects the first control signal pad of the first region to the control signal pad of the second region;
- a second data signal line that connects the second data signal pad of the first region to the data signal pad of the third region;
- and
- a second control signal line that connects the second control signal pad of the first region to the control signal pad of the third region,
- wherein the first and second data signal lines and the first and second control signal lines are at a same vertical level and horizontally spaced apart from each other.
7 more elements
A semiconductor device comprising:
- a controller;
- first and second drive circuits that are configured to drive a display panel and are connected to the controller by first and second pluralities of signal lines, respectively;
- and
- a film comprising thereon the first and second pluralities of signal lines, the controller, and the first and second drive circuits,
- wherein each of the first plurality of signal lines and each of the second plurality of signal lines is in a single layer of non-overlapping signal lines on the film, such that the first and second pluralities of signal lines are non-overlapping on the film.
2 more elements
Dependencies are inferred from the claim text.