Memory device
AssigneeSamsung Electronics Co., Ltd.
InventorsZhe Wu, Dong-ho Ahn, Hideki Horii, Soon-oh Park, Jeong-hee Park, Jin-woo Lee, Dong-jun Seong, Seol Choi
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AssigneeSamsung Electronics Co., Ltd.
InventorsZhe Wu, Dong-ho Ahn, Hideki Horii, Soon-oh Park, Jeong-hee Park, Jin-woo Lee, Dong-jun Seong, Seol Choi
Estimating the term…
A memory device includes a variable resistance layer and a selection device layer electrically connected to the variable resistance layer. The memory device further included a chalcogenide switching material that reduces leakage current and has, for example, a composition according to chemical formula 1 below, [GeXSiY(AsaTe1-a)Z](1-U)[N]U (1) (where 0.05≦X≦0.1, 0.15≦Y≦0.25, 0.7≦Z≦0.8, X+Y+Z=1, 0.45≦a≦0.6, and 0.08≦U≦0.2).
A memory device comprising:
A memory device comprising:
17-22. (canceled)
A memory device comprising:
(canceled)
28-33. (canceled)
Dependencies are inferred from the claim text.