Image sensor device and method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin
Estimating the term…
An image sensor device includes a first substrate, an interconnect structure, a conductive layer, a conductive via and a second substrate. The first substrate includes a first region including a pixel array and a second region including a circuit. The interconnect structure is over the pixel array or the circuit. The interconnect structure electrically connecting the circuit to the pixel array. The conductive layer is on the interconnect structure. The conductive via passes through the second substrate and at least partially embedded in the conductive layer. The second substrate is over the conductive layer.
An image sensor device, comprising:
An image sensor device, comprising:
An image sensor device, comprising:
Dependencies are inferred from the claim text.