Vertical Memory Devices and Methods of Manufacturing the Same
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-yong Park, Kee-jeong Rho, Hyeong Park, Tae-wan Lim
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AssigneeSamsung Electronics Co., Ltd.
InventorsSang-yong Park, Kee-jeong Rho, Hyeong Park, Tae-wan Lim
Estimating the term…
Vertical memory devices, and methods of manufacturing the same, include providing a substrate including a cell array region and a peripheral circuit region, forming a mold structure in the cell array region, forming an opening for a common source line passing through the mold structure and extending in a first direction perpendicular to a top surface of the substrate, forming a first contact plug having an inner sidewall delimiting a recessed region in the opening for the common source line, and forming a common source bit line contact electrically connected to the inner sidewall of the first contact plug.
A method of manufacturing a vertical memory device, the method comprising:
A method of manufacturing a vertical memory device, comprising:
Dependencies are inferred from the claim text.