Semiconductor device

A semiconductor device comprising:

• at least one first element formed of a first constituent as a main constituent, the at least one first element having electrodes at a front surface and a rear surface opposite to the front surface;
• at least one second element formed of a second constituent different from the first constituent as a main constituent, the at least one second element having electrodes at a front surface and a rear surface opposite to the front surface;
• a heat sink on which the at least one first element and the at least one second element are disposed;
• a first connection layer electrically connecting the electrode at the rear surface of the at least one first element to the heat sink;
• a second connection layer electrically connecting the electrode at the rear surface of the at least one second element to the heat sink;
• and
• a mold resin covering and protecting the at least one first element, the at least one second element and the heat sink, wherein
• a part of a surface of the heat sink is exposed from the mold resin, and
• sizes of the at least one first element and the at least one second element are set so that an equivalent plastic strain increment of the first connection layer is greater than an equivalent plastic strain increment of the second connection layer.