Package-on-Package Devices with WLP Components with Dual RDLS for Surface Mount Dies and Methods Therefor

A method for forming a package-on-package device, comprising:

• obtaining a package substrate;
• first surface mount coupling a first integrated circuit die to an upper surface of the package substrate;
• coupling conductive lines to the upper surface of the package substrate in a fan-out region, the first conductive lines extending away from the upper surface of the package substrate;
• forming a molding layer over the upper surface of the package substrate, around sidewall surfaces of the first integrated circuit die, and around bases and shafts of the conductive lines;
• second surface mount coupling a first and a second wafer-level packaged microelectronic component located at a same level above an upper surface of the molding layer respectively to sets of upper portions of the conductive lines;
• each of the first and the second wafer-level packaged microelectronic components having a second integrated circuit die located between a first redistribution layer and a second redistribution layer;
• and
• third surface mount coupling a third and a fourth integrated circuit die respectively over the first and the second wafer-level packaged microelectronic components.