US 2018/0026017 A1 · Dies-on-Package Devices and Methods Therefor

Abstract

Dies-on-package devices and methods therefor are disclosed. In a dies-on-package device, a first IC die is surface mount coupled to an upper surface of a package substrate. Conductive lines are coupled to the upper surface of the package substrate in a fan-out region with respect to the first IC die. A molding layer is formed over the upper surface of the package substrate, around sidewall surfaces of the first IC die, and around bases and shafts of the conductive lines. A plurality of second IC dies is located at a same level above an upper surface of the molding layer respectively surface mount coupled to sets of upper portions of the conductive lines. The plurality of second IC dies are respectively coupled to the sets of the conductive lines in middle third portions respectively of the plurality of second IC dies for corresponding fan-in regions thereof.

Claims19

Dependent claims

A dies-on-package device, comprising:

a package substrate;
a first integrated circuit die surface mount coupled to an upper surface of the package substrate;
conductive lines coupled to the upper surface of the package substrate in a fan-out region with respect to the first integrated circuit die, the first conductive lines extending away from the upper surface of the package substrate;
a molding layer formed over the upper surface of the package substrate, around sidewall surfaces of the first integrated circuit die, and around bases and shafts of the conductive lines;
and
a plurality of second integrated circuit dies located at a same level above an upper surface of the molding layer respectively surface mount coupled to sets of upper portions of the conductive lines;
the plurality of second integrated circuit dies respectively coupled to the sets of the conductive lines in middle third portions respectively of the plurality of second integrated circuit dies for corresponding fan-in regions thereof.

4 more elements

A method for forming a dies-on-package device, comprising:

obtaining a package substrate;
first surface mount interconnecting a first integrated circuit die to an upper surface of the package substrate;
coupling conductive lines to the upper surface of the package substrate in a fan-out region, the conductive lines extending away from the upper surface of the package substrate;
forming a molding layer over the upper surface of the package substrate, around sidewall surfaces of the first integrated circuit die, and around bases and shafts of the conductive lines;
and
second surface mount interconnecting a plurality of second integrated circuit dies above an upper surface of the first molding layer, the second surface mount interconnecting including coupling sets of upper portions of the conductive lines respectively to the plurality of second integrated circuit dies for corresponding fan-in regions thereof.

3 more elements

Dependencies are inferred from the claim text.

Dies-on-Package Devices and Methods Therefor

Life of this patent

Dies-on-Package Devices and Methods Therefor

Life of this patent

Abstract

Claims19