Package-on-Package Structure with Through Molding Via

A device package comprising:

• a semiconductor die flip-chip bonded to first contact pads at a surface of a first substrate;
• a second substrate flip-chip bonded to second contact pads at the surface of the first substrate by a plurality of connectors;
• a molding compound encapsulating the semiconductor die, the molding compound comprising a plurality of sidewalls, the plurality of sidewalls encircling each of the plurality of connectors in a top-down view, and a portion of the molding compound is disposed between each of the plurality of connectors;
• a cavity extending through the molding compound, the cavity being free of any conductive features disposed therein, wherein a top and bottom of each of the plurality of connectors are disposed at a same level with a respective top and bottom of the cavity, and wherein the cavity has a same shape in a plan view as each of the plurality of sidewalls.

A device comprising:

• a first package having a first side with a plurality of connectors disposed thereon;
• a second package bonded to the first package by the plurality of connectors;
• a molding compound disposed between the first side of the first package and the second package, a continuous sidewall of the molding compound completely encircles at least two of the plurality of connectors, and wherein no molding compound is disposed between any of the at least two of the plurality of connectors;
• and
• a cavity extending through the molding compound, wherein the cavity is free of metal disposed therein.