Memory device including interposer and system-in-package including the same

A system-in-package comprising:

• a processor;
• an interposer connected to the processor;
• a first memory die attached to a first surface of the interposer, the first memory die including a first physical layer, the first physical layer configured to perform input and output of data to and from the processor;
• and
• a second memory die attached to a second surface of the interposer, the second memory die including a second physical layer, the second physical layer configured to perform input and output of data to and from the processor, the second physical layer not interfering with the first physical layer in a plan view.

A system-in-package comprising:

• an interposer including a first plurality of paths and a second plurality of paths, the interposer including a top surface and a bottom surface;
• a processor die at a first side of the interposer, the processor die attached to one of the top surface or the bottom surface of the interposer at the first side of the interposer, the processor connected to both the first plurality of paths and the second plurality of paths;
• a first memory die at a second side of the interposer, the second side opposite to the first side, the first memory die attached to the top surface of the interposer, the first memory die including a first physical layer connected to the first plurality of paths;
• and
• a second memory die at the second side of the interposer, the second memory die attached to the bottom surface of the interposer, the second memory die including a second physical layer connected to the second plurality of paths, the second plurality of paths not overlapping the first plurality of paths in a plan view.