Multilayer substrate
AssigneeDexerials Corporation
InventorsYasushi AKUTSU, Tomoyuki ISHIMATSU
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Abstract
Provided is a multilayer substrate obtained by laminating semiconductor substrates each having a trough electrode. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are each selectively present at a position where the through electrodes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through electrodes are connected by the conductive particles, and the semiconductor substrates each having the through electrode are bonded by an insulating adhesive.
Claims12
A multilayer substrate comprising semiconductor substrates which each have a through electrode and are laminated to each other, wherein
- conductive particles are each selectively present at a position where the through electrodes face each other as viewed in a plan view of the multilayer substrate, and
- the multilayer substrate has a connection structure in which the facing through electrodes are connected by the conductive particles, and the semiconductor substrates each having the through electrode are bonded together by an insulating adhesive.
A method for manufacturing a multilayer substrate in which through electrodes formed in semiconductor substrates are faced and joined each other, the method comprising:
- putting between the semiconductor substrates each having the through electrode an anisotropic conductive film in which conductive particles are selectively disposed in an insulating adhesive layer so as to each correspond to a position where the through electrodes face each other as viewed in a plan view of the multilayer substrate;
- and pressurizing the anisotropic conductive film under heating to achieve anisotropic conductive connection of the semiconductor substrates.
An anisotropic conductive film comprising an insulating adhesive layer and conductive particles disposed in the insulating adhesive layer, wherein the conductive particles are selectively disposed in the insulating adhesive layer so as to correspond to an arrangement of through electrodes connected by the anisotropic conductive film.
An anisotropic conductive film comprising an insulating adhesive layer and conductive particles disposed in the insulating adhesive layer, wherein a conductive particle unit including three or more adjacent conductive particles is formed, and
- in the conductive particle unit, a distance between any conductive particle and a conductive particle closest to the conductive particle is 0.2 to 0.5 times a particle diameter of the conductive particles.
Dependencies are inferred from the claim text.