Package structure and manufacturing method thereof

A package structure, comprising:

• a first die, molded in a molding compound;
• a first redistribution layer, disposed on the molding compound and electrically connected to the first die;
• at least one through via, molded in the molding compound and electrically connected to the first redistribution layer;
• a second die, disposed on the molding compound and electrically connected to the first redistribution layer, wherein the molding compound is located between the second die and the first redistribution layer;
• a sealing material disposed on the molding compound and located between the second die and the molding compound, wherein the sealing material has at least one contact window exposing the through via;
• an electromagnetic interference shielding layer, disposed over the second die, wherein the electromagnetic interference shielding layer is in contact with the through via through the contact window;
• and
• conductive elements, connected to the first redistribution layer, wherein the first redistribution layer is located between the conductive elements and the molding compound.

A method of manufacturing a package structure, comprising:

• disposing a first die on a car er;
• forming at least one first through interlayer via on the carrier;
• encapsulating the first die and the first through interlayer via in a molding compound;
• forming a first redistribution layer on the molding compound, wherein the first redistribution layer is electrically connected to the first die and the first through interlayer via;
• disposing conductive elements on the first redistribution layer, wherein the first redistribution layer is located between the molding compound and the conductive elements;
• debonding the carrier from the first die and the first through interlayer via;
• disposing a second die on the molding compound, wherein the second die is electrically connected to the first redistribution layer, and the molding compound is located between the second die and the first redistribution layer;
• disposing a sealing material between the second die and the molding compound;
• forming at least one contact window exposing the first through interlayer via by performing a laser drilling on the sealing material;
• and
• forming an electromagnetic interference shielding layer over the second die, wherein the electromagnetic interference shielding layer is in contact with the first through interlayer via through the contact window.