Power electronic switching device, arrangement herewith and methods for producing the switching device

A method, for producing a first configuration of a power electronic switching device (1), comprising the steps of:

• A. providing a substrate (2) comprising an insulation layer (20) and a plurality of conductor tracks (22);
• each said conductor track (22) electrically insulated from one another;
• B. providing a connection device (3) embodied as a film stack;
• said film stack formed with an electrically insulating film (32) spaced between two electrically conductive inherently structured films (30, 34);
• wherein a power semiconductor component (7) is connected to a contact location of the connection device (3) in one of a materially bonded manner and an electrically conductive manner;
• C. arranging an adhesive substance (36) on one of the substrate (2) and the connection device (3) at adhesive sections which do not serve for electrically conductive connections between said connection device (3) and the substrate (2);
• D. arranging and adhesively connecting the connection device (3) to the substrate (2) by the adhesive substance (36);
• and
• E. introducing a pressure on the connection device (3) by a pressure device (5) and a pressure introducing device (6) thereby forming a force-locking electrically conductive connection between the substrate (2) and the power semi conductor component (7).

A method for producing a second configuration of a power electronic switching device (1), comprising the steps of:

• providing a substrate (2) comprising an insulation layer (20) and a plurality of conductor tracks (22) electrically insulated from one another;
• b. providing a connection device (3) embodied as a film stack;
• said film stack embodied as an electrically insulating film (32) between two electrically conductive inherently structured films (30, 34);
• c. arranging a power semiconductor component (7) on an assigned one of said plurality of conductor track (22) of said substrate (2);
• d. arranging an adhesive substance (36) and adhesively fixing the power semiconductor component (7) on at least one of assigned conductor tracks (22);
• e. arranging and adhesively connecting the connection device (3) to the substrate (2) by means of the adhesive substance (36);
• and
• f. introducing a pressure on the connection device (3) by urging a pressure introducing device (6) and a pressure device (5) to form a force-locking electrically conductive connection between the power semiconductor component (7) and the assigned conductor track (22) of the substrate (2).