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US 2018/0025999 A1Published application
Info package with integrated antennas or inductors
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Chuei-Tang Wang
Life of this patent
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Abstract
In some embodiments, a semiconductor package includes a die surrounded by a molding material, a redistribution layer over the die and the molding material, the redistribution layer electrically coupled to the die, and a first conductive structure in the molding material and electrically coupled to the die, the first conductive structure being an inductor or an antenna.
Claims21
A semiconductor package comprising:
- a die surrounded by a molding material;
- a redistribution layer over the die and the molding material, the redistribution layer electrically coupled to the die;
- and
- a first conductive structure in the molding material and electrically coupled to the die, the first conductive structure comprising an antenna, wherein at least a portion of a top edge of the antenna and at least a portion of a top edge of the die intersect a same plane parallel to a major plane of the molding material.
1 more element
A semiconductor package comprising:
- a first dielectric layer;
- a die attached to a first side of the first dielectric layer;
- a molding compound around the die and over the first side of the first dielectric layer;
- a first redistribution layer over the die and the molding compound, the first redistribution layer electrically coupled to the die;
- and
- a first conductive feature in the molding compound and between the first dielectric layer and the first redistribution layer, the first conductive feature comprising an antenna electrically coupled to the die, wherein the antenna comprises two non-overlapping metal walls in a top view, the two metal walls separated by the molding compound.
3 more elements
(canceled)
A method of forming a semiconductor package comprising:
- attaching a die to a first side of a first redistribution layer;
- forming a conductive feature on the first side of the first redistribution layer, the conductive feature comprising an antenna;
- forming a molding compound over the first side of the first redistribution layer, and around the die and the conductive feature;
- and
- forming a second redistribution layer over the die and the molding compound, the second redistribution layer electrically coupling the conductive feature to the die, wherein the second redistribution layer comprises a via extending through a dielectric layer, and at least a portion of a first interface between the dielectric layer and the antenna and at least a portion of a second interface between the via and the antenna intersect a same plane parallel to a major plane of the molding compound.
2 more elements
Dependencies are inferred from the claim text.