Surface mount package and manufacturing method thereof

Abstract

An object of the present invention is to provide a surface-mount type package for semiconductor chips which is resistant to failures caused by thermal stress. As a means for achieving the object, a method for manufacturing a surface-mount type package whose face parallel with the semiconductor chip surface has a circular cross-section, is provided, wherein such method is characterized in that it comprises at least the following steps in this order. A first step in which a semiconductor chip is bonded onto a circular support substrate. A second step in which the semiconductor chip is sealed with resin. A third step in which the resin covering the pads of the semiconductor chip is removed. A fourth step in which a rewiring layer is formed. A fifth step in which bumps are formed.

Dependencies are inferred from the claim text.