Integrated fan-out package

An integrated fan-out package, comprising:

• an integrated circuit comprising an inductor embedded therein;
• an insulating encapsulation encapsulating the integrated circuit;
• and
• a redistribution circuit structure disposed on the integrated circuit and the insulating encapsulation, the redistribution circuit structure being electrically connected to the integrated circuit, and the redistribution circuit structure comprising a first wiring-free dielectric portion located above the inductor.

An integrated fan-out package, comprising:

• an integrated circuit comprising an antenna region;
• an insulating encapsulation encapsulating the integrated circuit;
• and
• a redistribution circuit structure disposed on the integrated circuit and the insulating encapsulation, the redistribution circuit structure being electrically connected to the integrated circuit, the redistribution circuit structure comprising a plurality of dielectric layers and a plurality of redistribution conductive layers stacked alternately, and the redistribution conductive layers comprising a plurality of redistribution wirings and a plurality of dummy patterns located above the antenna region.