Semiconductor device and method of forming vertical one-time-programmable fuse
AssigneeSemiconductor Components Industries, LLC
InventorsJefferson W. HALL, Gordon M. GRIVNA
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AssigneeSemiconductor Components Industries, LLC
InventorsJefferson W. HALL, Gordon M. GRIVNA
Estimating the term…
A vertical OTP fuse formed in a semiconductor device has a substrate and an insulating layer formed over the substrate with an opening through the insulating layer extending to the substrate. A conductive layer, such as silicide, is formed over a sidewall of the opening. A resistive material, such as polysilicon, is deposited within the opening over the first conductive layer to form a first vertical OTP fuse. A plurality of vertical OTP fuses can be arranged in an array. A PN junction diode or transistor is formed in the substrate aligned with the first vertical OTP fuse. A second conductive layer is formed over the first vertical OTP fuse. The first vertical OTP fuse can be disposed between the second conductive layer and a third conductive layer. A second vertical OTP fuse can be formed over the first vertical OTP fuse for redundancy.
A method of making a semiconductor device, comprising:
A method of making a vertical one-time-programmable (OTP) fuse, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.