Interconnection structure and method of forming the same

An interconnection structure, comprising:

• a non-insulator structure;
• a liner layer over the non-insulator structure;
• a dielectric structure over the liner layer;
• and
• a conductive structure extending through the dielectric structure and the liner layer and electrically connected to the non-insulator structure, wherein the conductive structure is in contact with a first sidewall of the dielectric structure, a sidewall of the liner layer, and a top surface of the non-insulator structure.

A method of forming an interconnection structure, comprising:

• defining a recess within a dielectric structure;
• forming an anti-adhesion layer on at least one sidewall of the dielectric structure defining the recess, wherein:
• the anti-adhesion layer comprises an upper portion, a sidewall portion, and a bottom portion, and
• a portion of the dielectric structure underlies the bottom portion of the anti-adhesion layer;
• and
• removing the upper portion of the anti-adhesion layer, the bottom portion of the anti-adhesion layer, and the portion of the dielectric structure underlying the bottom portion of the anti-adhesion layer.